多弧离子镀沉积TiN-Cu复合膜

TiN-Cu composite films deposited by multi-arc ion plating

摘要:

摘要：利用多弧离子镀的方法，分别在不同弧电流和沉积时间下，在不锈钢基体上沉积TiN-Cu复合膜；对薄膜表面形貌、截面形貌、相组成和硬度进行表征。结果表明，复合膜中的Cu含量、沉积条件对薄膜微观结构和硬度有重要的影响。金属Cu的加入，阻止了TiN柱状晶的生长，改变了纯TiN薄膜的择优取向；当沉积时间为2h，脉冲负偏压为200V时，Cu含量为12.96at%，复合膜硬度达到最大值为2976HV。

Abstract:

Abstract：TiN-Cu composite films were deposited on stainless substrates at different arc current and deposited time, using a type of multi-arc ion plating system. The surface morphology, cross-sectional morphology, phase structure and hardness of composite films were characterized. The results show that, with increasing in the Cu content, metallic Cu can inhibit the columnar growth and change the preferred orientation of pure TiN films. The highest value of composite film hardness is obtained with 12.96at% Cu, when deposited time is 2h and negative pulse bias is 200V. Cu content and deposition condition have a great impact on the hardness of composite films.