基于多层板过孔互连结构的小型化微波整流电路设计

Design of a miniaturized rectifying circuit with a via-hole interconnected multilayer structure

摘要:

本文设计了一种新颖的基于多层结构的微波整流电路，在该电路中使用过孔连接多层板的各导体层。在此基础上，加工了基于HSMS-282C肖特基二极管的S波段多层整流电路，其微波到直流转换效率达到73%。与传统的微带整流电路相比，多层整流电路与其转换效率相近且能极大的减小电路物理尺寸。实验结果表明本文采用的多层整流电路能够在不牺牲整流效率的前提下实现小型化的目标，从而满足微波无线输能系统的大规模集成及小型化需求。

Abstract:

This article proposes a novel concept for constructing a microwave (MW) rectifying circuit by using a multilayer structure, aiming at reducing physical dimensions. Specifically, conductor layers in the multilayer structure are interconnected with an embedded via-hole. Then, an S-band rectifying circuit based on HSMS-282C Schottky diode is fabricated with the proposed multilayer structure for demonstration. The maximum MW-DC conversion efficiency of 73% has been measured. In comparison with the conventional microstrip rectifying circuit, the proposed multilayer circuit shows a great reduction of physical dimensions and a very similar efficiency, which validates that the proposed circuit can reduce physical dimensions significantly without sacrificing the MW-DC conversion efficiency.